PCB technical capabilities:

According to standards: IPC-A-600 Class 2
(The standard is available on request)

1-12 layers

Layer build-up according to requirements - Selection

Base copper thickness	Min. copper thickness after plating	Minimum track width / isolation gap
18 µm	33.4 µm	0.090 mm
35 µm	47.9 µm	0.100 mm
70 µm	78.7 µm	0.150 mm
105 µm	108.5 µm	0.180 mm

Minimum drill diameter: 0.10 mm (after plating 0.05 mm)

Aspect ratio:1:10
(For PCB thick. 1.50 mm, min. drill Ø 0.15 mm, after PTH 0.10 mm)
(For PCB thick. 1.00 mm, min. drill Ø 0.10 mm, after PTH 0.05 mm)

Colors: green, blue, red, white, black, yellow

Class VII, min.drilled hole diameter 0,20 mm
(Final hole diameter after plating 0,15 mm)
Learn more...

Colors: green, blue, red, white, black, yellow

lead-free HAL
HAL SnPb
chemical Niau

milling
V-cut

electrical test
optical test- AOI
controlled impedance
micro sections

1. Controlled Impedance calculation, stack-up adjustment
2. Test Coupon design
3. Controlled Impedance measurement
Learn more...

Manufacturing Standard IPC-A-600 Class3

UL certification UL-file number:E258735

Total PCB thickness up to 5 mm

Edge plating
plated half-hole

carbon layer
removable paint
Via-hole filler

Z-axis milling
Interrupted grooving
press-fit holes

buried holes
blind holes - aspect Ratio 1:1

ceramic materials on request

or contact us individually